Heater assembly for an aerosol-generating system

ABSTRACT

A heater assembly for an aerosol-generating system includes a perforated glass substrate and a heater element. The heater element is provided in the glass substrate, on the glass substrate, or both in and on the glass substrate. The heater element includes a plurality of parallel strips between alternating rows of the perforations.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/796,238, filed on Feb. 20, 2020, which is a continuation of U.S.application Ser. No. 16/416,739, filed May 20, 2019, which is acontinuation of U.S. application Ser. No. 15/623,849, filed Jun. 15,2017, which is a continuation of and claims priority to, internationalapplication no. PCT/EP2017/062303, filed on May 22, 2017, and furtherclaims priority under 35 U.S.C. § 119 to European Patent Application No.16175298.5, filed Jun. 20, 2016, the entire contents of each of whichare incorporated herein by reference.

BACKGROUND Field

Example embodiments relate to a heater assembly for anaerosol-generating system and an aerosol-generating system comprisingthe heater assembly.

Description of Related Art

Handheld electrically operated aerosol-generating systems may include abattery and electric circuitry, a cartridge comprising a supply of aliquid aerosol-forming substrate held in a liquid storage portion, andan electrically operated vaporiser. A mesh heater may be utilized as avaporiser. Such a mesh heater is disclosed, for example, in WO2015/117702 A1 the entire content of which is incorporated herein byreference thereto, in which the mesh heater is provided by a pluralityof electrically conductive metal filaments.

SUMMARY

At least one example embodiment relates to a heater assembly for anaerosol-generating system.

In at least on example embodiment, a heater assembly for anaerosol-generating system comprises a perforated glass substrateincluding perforations; and a heater element. The heater element islocated in at least one of in the glass substrate and on the glasssubstrate.

In at least one example embodiment, the perforations have a widthranging from about 1 micron to about 500 microns. In at least oneexample embodiment, the perforations have a width ranging from about 5microns to about 250 microns. In at least one example embodiment, theperforations have a width ranging from about 10 microns to about 150microns.

In at least one example embodiment, a distance between adjacent ones ofthe perforations of the glass substrate ranges from about 1 micron toabout 1000 microns. In at least one example embodiment, the distancebetween adjacent ones of the perforations of the glass substrate rangesfrom about 5 microns to about 750 microns. In at least one exampleembodiment, the distance between adjacent ones of the perforations ofthe glass substrate ranges from about 10 microns to about 500 microns.

In at least one example embodiment, at least one of the heater elementand the perforations of the glass substrate include at least one of amesh and an array. An area of at least one of the mesh and the array isless than about 25 square millimetres. In at least one exampleembodiment, the area is about 15 square millimetres. About 25 percent ofthe surface area to about 56 percent of the surface area of at least oneof the mesh and the array is fluid-permeable.

In at least one example embodiment, a length of the heater assembly isabout 3 millimetres and a width of the heater assembly is about 5millimetres.

In at least one example embodiment, the heater element is a thin film onthe glass substrate.

In at least one example embodiment, the heater element is incorporatedinto the glass substrate, such that the heater element is isolated froman adjacent aerosol-forming substrate.

In at least one example embodiment, the heater element is providedwithin at least one of the perforations.

In at least one example embodiment, the heater assembly also includestwo perforated glass substrates. The heater element is between the twoperforated glass substrates.

At least one example embodiment relates to an aerosol-generating system.

In at least one example embodiment, an aerosol-generating systemcomprises a main body, a battery in the main body, electric circuitry inthe main body, a mouthpiece in the main body, a liquid storage portionattachable to the main body, and a heater assembly in the main body. Theheater assembly includes a perforated glass substrate includingperforations and a heater element. The heater element is located in atleast one of in the glass substrate and on the glass substrate.

In at least one example embodiment, the heater element is adjacent tothe liquid storage portion when the liquid storage portion is attachedto the main body.

In at least one example embodiment, the heater element is in themouthpiece.

At least one example embodiment relates to a method for manufacturing aheater assembly for an aerosol-generating system.

In at least one example embodiment, a method for manufacturing a heaterassembly for an aerosol-generating system, comprises providing aperforated glass substrate, and placing a heater element in at least oneof in the glass substrate and on the glass substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Features described in relation to one example embodiment may equally beapplied to other example embodiments.

Example embodiments will now be described with reference to theaccompanying drawings.

FIGS. 1a, 1b, and 1c are images of heater assemblies according to atleast one example embodiment.

FIG. 2 is an illustration of a perforation of an embodiment of theheater assembly according to at least one example embodiment.

FIG. 3 is a sectional view of a heater assembly with a liquid storageportion according to at least one example embodiment.

FIGS. 4a, 4b, and 4c are cross-sectional views of an aerosol-generatingsystem according to at least one example embodiment.

DETAILED DESCRIPTION

Example embodiments will become more readily understood by reference tothe following detailed description of the accompanying drawings. Exampleembodiments may, however, be embodied in many different forms and shouldnot be construed as being limited to the example embodiments set forthherein. Rather, these example embodiments are provided so that thisdisclosure will be thorough and complete. Like reference numerals referto like elements throughout the specification.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willbe further understood that the terms “comprises,” “comprising,”“includes,” and/or “including,” when used in this specification, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on”, “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings set forth herein.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper”, and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the example term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

Example embodiments are described herein with reference to cross-sectionillustrations that are schematic illustrations of idealized embodiments(and intermediate structures). As such, variations from the shapes ofthe illustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, these example embodimentsshould not be construed as limited to the particular shapes of regionsillustrated herein, but are to include deviations in shapes that result,for example, from manufacturing. For example, an implanted regionillustrated as a rectangle will, typically, have rounded or curvedfeatures and/or a gradient of implant concentration at its edges ratherthan a binary change from implanted to non-implanted region. Likewise, aburied region formed by implantation may result in some implantation inthe region between the buried region and the surface through which theimplantation takes place. Thus, the regions illustrated in the figuresare schematic in nature and their shapes are not intended to illustratethe actual shape of a region of a device and are not intended to limitthe scope of this disclosure.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art. It will be further understood that terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and this specification and will not beinterpreted in an idealized or overly formal sense unless expressly sodefined herein.

Unless specifically stated otherwise, or as is apparent from thediscussion, terms such as “processing” or “computing” or “calculating”or “determining” or “displaying” or the like, refer to the action andprocesses of a computer system, or similar electronic computing device,that manipulates and transforms data represented as physical, electronicquantities within the computer system's registers and memories intoother data similarly represented as physical quantities within thecomputer system memories or registers or other such information storage,transmission or display devices.

In the following description, illustrative embodiments may be describedwith reference to acts and symbolic representations of operations (e.g.,in the form of flow charts, flow diagrams, data flow diagrams, structurediagrams, block diagrams, etc.) that may be implemented as programmodules or functional processes including routines, programs, objects,components, data structures, etc., that perform particular tasks orimplement particular abstract data types. The operations be implementedusing existing hardware in existing electronic systems, such as one ormore microprocessors, Central Processing Units (CPUs), digital signalprocessors (DSPs), application-specific-integrated-circuits (ASICs),SoCs, field programmable gate arrays (FPGAs), computers, or the like.

Further, one or more example embodiments may be (or include) hardware,firmware, hardware executing software, or any combination thereof. Suchhardware may include one or more microprocessors, CPUs, SoCs, DSPs,ASICs, FPGAs, computers, or the like, configured as special purposemachines to perform the functions described herein as well as any otherwell-known functions of these elements. In at least some cases, CPUs,SoCs, DSPs, ASICs and FPGAs may generally be referred to as processingcircuits, processors and/or microprocessors.

Although processes may be described with regard to sequentialoperations, many of the operations may be performed in parallel,concurrently or simultaneously. In addition, the order of the operationsmay be re-arranged. A process may be terminated when its operations arecompleted, but may also have additional steps not included in thefigure. A process may correspond to a method, function, procedure,subroutine, subprogram, etc. When a process corresponds to a function,its termination may correspond to a return of the function to thecalling function or the main function.

As disclosed herein, the term “storage medium”, “computer readablestorage medium” or “non-transitory computer readable storage medium,”may represent one or more devices for storing data, including read onlymemory (ROM), random access memory (RAM), magnetic RAM, core memory,magnetic disk storage mediums, optical storage mediums, flash memorydevices and/or other tangible machine readable mediums for storinginformation. The term “computer-readable medium” may include, but is notlimited to, portable or fixed storage devices, optical storage devices,and various other mediums capable of storing, containing or carryinginstruction(s) and/or data.

Furthermore, at least some portions of example embodiments may beimplemented by hardware, software, firmware, middleware, microcode,hardware description languages, or any combination thereof. Whenimplemented in software, firmware, middleware or microcode, the programcode or code segments to perform the necessary tasks may be stored in amachine or computer readable medium such as a computer readable storagemedium. When implemented in software, processor(s), processingcircuit(s), or processing unit(s) may be programmed to perform thenecessary tasks, thereby being transformed into special purposeprocessor(s) or computer(s).

A code segment may represent a procedure, function, subprogram, program,routine, subroutine, module, software package, class, or any combinationof instructions, data structures or program statements. A code segmentmay be coupled to another code segment or a hardware circuit by passingand/or receiving information, data, arguments, parameters or memorycontents. Information, arguments, parameters, data, etc. may be passed,forwarded, or transmitted via any suitable means including memorysharing, message passing, token passing, network transmission, etc.

At least one example embodiment relates to a heater assembly for anaerosol-generating system.

In at least one example embodiment, a heater assembly for anaerosol-generating system includes a perforated glass substrate and aheater element. The heater element is in or on the glass substrate.

Glass has a high heat resistance. Thus, heating products may be reducedand/or substantially prevented when the heater element adjacent to theglass substrate is heated and vaporises liquid aerosol-formingsubstrate. The heater element in or on the glass substrate may be heatedto relatively high temperatures without damaging the glass substrate andwithout creating heating products due to burning of substrate or burningresidues on the glass substrate.

Glass is also temperature stable, such that a multitude of heating andsubsequent cooling processes may be performed by the heater elementwithout the glass substrate degrading. Thus, the aerosol, which isgenerated by the heater assembly during vaporisation of liquidaerosol-forming substrate, may be maintained at a consistent quality.

The perforated glass substrate and the heater element may be easilycleaned due to the surface characteristics of glass. Glass may have asmooth and hard surface so that the glass substrate is not damaged orharmed during cleaning of the glass substrate. Burning residues andcontaminants may be cleaned from the surface of the glass substrate.

The perforated glass substrate may enable the liquid aerosol-formingsubstrate to flow through the glass substrate and to be vaporised by theheater element of the heater assembly. The glass substrate includesperforations which have a diameter that allows the liquidaerosol-forming substrate to flow through the glass substrate.

The glass substrate is a generally flat element having any suitable sizeand shape which allows its incorporation into a handheld system. An areaof the glass substrate may be small. In at least one example embodiment,the area of the glass substrate is less than or equal to about 40 squaremillimeters, less than or equal to about 30 square millimetres, or lessthan or equal to about 20 square millimeters. A thickness of the glasssubstrate may be equal to or less than about 2 millimeters, equal to orless than about 1 millimeter, or equal to or less than about 0.5millimeter.

The glass substrate may have a generally rectangular shape or agenereally circular shape. In at least one example embodiment, the shapeof the glass substrate is adapted to the dimensions of the liquidstorage portion of the aerosol generating system.

In at least one example embodiment, the perforations of the glasssubstrate have a width ranging from about 1 micron to about 500 microns,from about 5 microns to about 250 microns, or from about 10 microns toabout 150 microns.

Perforations in the glass substrate with such a width may allow adesired (or, alternatively predetermined) amount of liquidaerosol-forming substrate to flow through the glass substrate. Theamount of liquid aerosol-forming substrate that may flow through theglass substrate is chosen such that enough aerosol is generated by theheater assembly.

A distance between the perforations of the glass substrate ranges fromabout 1 micron to about 1000 microns, from about 5 microns to about 750microns, or from about 10 microns to about 500 microns.

The distance between the perforations may provide a dimensionalstability of the glass substrate, such that the glass substrate is notprone to breaking during heating and cleaning and is not deformedeasily. Distances between the perforations and perforations of the glasssubstrate with the above described width result in the surface area ofthe glass substrate being enlarged, while a relatively high dimensionalstability of the glass substrate and the heater assembly may beprovided.

In a least one example embodiment, about 15 percent to about 70 percent,about 20 percent to about 60 percent, or about 25 percent to about 55percent of the glass substrate of the heater assembly may befluid-permeable.

Amounts of liquid aerosol-forming substrate can permeate through theheater assembly to be vaporised, while the heater assembly isdimensionally stable. The heater element of the heater assembly may bein the form of a mesh or array, such that the surface area, which can beutilized for vaporising liquid aerosol-forming substrate, may beincreased (e.g., optimized).

The heater element vaporises the liquid aerosol-forming substrate. Thevaporised liquid aerosol-forming substrate forms an aerosol. The heaterelement is an electric resistance heater, which may be heated by anelectric current. The heater element is made of an electricallyconductive material such as aluminium or copper. Any other suitableelectrically conductive material could be used as material for theheater element.

The heater element is on a surface of the glass substrate. In at leastone example embodiment, the heater element is directly on the surface ofthe glass substrate. The heater element may be a coating or thin film,such as a metallic coating or metallic thin film.

In at least one example embodiment, the heater element may be in theglass substrate. The heater element may be incorporated into the glasssubstrate such that the heater element is encapsulated or encompassed bythe glass substrate. The heater element may be provided as a metalliccoating or thin metallic foil sandwiched between two layers of glasssubstrate. By encapsulating the heater element in the glass substrate orby sandwiching the heater element between two layers of glass substrate,the heater element is substantially protected from contact with theenvironment and in particular from contact with the liquidaerosol-forming substrate. As the liquid aerosol-forming substrate doesnot come into direct contact with the hot heater element, but only withthe glass substrate, burning residues of liquid aerosol-formingsubstrate are less likely to be generated on the heater element duringor after the vaporisation of the liquid aerosol-forming substrate.

By sandwiching the metallic heater thin film in between two layers ofglass substrate delaminating of the metallic thin film can efficientlybe reduced and/or substantially prevented.

The heater element may extend over the full width of the glasssubstrate. The heating element may also be provided as an array oflinear heating strips or may form a mesh of heating strips. The heatingelements could alternatively or additionally also be provided inside theperforations of the glass substrate.

In at least one example embodiment, the heater elements are within theperforations, only, and the heater elements may each have contactportions such that electric current may flow through the heater elementsand heat the heater elements. If the heater elements are provided in theperforations only, the liquid is directly heated when passing theperforations. In at least one example embodiment, it is not necessary toheat the complete glass substrate to elevated temperatures. Instead onlythe limited amount of liquid that is drawn into the perforations isheated at a time. Accordingly, less energy is required in evaporation ofthe liquid aerosol-forming substrate.

The heater assembly may be provided with electrically conductive contactregions for contacting the heating elements provided in or on the glasssubstrate. The contact regions may be provided in the peripheral area ofthe glass substrate and may be adapted to establish electric contact tothe control unit and the power supply of the aerosol-generating system.

At least one example embodiment relates to an aerosol-generating system.

In at least one example embodiment, an aerosol-generating systemincludes a main body and a heater assembly. In at least one exampleembodiment, the main body may comprise the heater assembly. The mainbody may further comprise a battery, electric circuitry, and amouthpiece. In at least one example embodiment, the aerosol-generatingsystem may be adapted to accommodate a replaceable or refillable liquidstorage portion. The liquid storage portion may be attachable to themain body. The main body may comprise a sensor, such as a flow sensor.The flow sensor may be configured to detect a draw on theaerosol-generating system. Following this detection, the electriccircuitry controls a flow of electric current from the battery throughthe heater element.

The heater assembly may be an integral part of the main body. Theaerosol-generating system is configured, such that in the assembledstate, the heater assembly is located adjacent to and in fluidcommunication with the liquid storage portion.

The liquid storage portion may comprise a housing having an opening,which may be sealed by a suitable sealing element. The sealing elementmay be a foil that can be removed before or upon insertion of the liquidstorage portion into the aerosol-generating system. The liquid storageportion further comprises a liquid aerosol-forming substrate that mayfully or partially be absorbed in a capillary element, provided withinthe liquid storage portion. The capillary element is within the liquidstorage portion in direct vicinity to the opening of the housing of theliquid storage portion.

When inserted into the aerosol-generating system, the opening of theliquid storage portion is located adjacent to the heater assembly, suchthat the capillary element of the liquid storage portion is in directcontact with the heater assembly. In at least one example embodiment,the liquid aerosol-forming substrate may be conveyed from the liquidstorage portion through the capillary element towards the heaterassembly. Thus, the heater element is moisturized with liquidaerosol-forming substrate.

Suitable capillary materials may have a spongy or fibrous structure,which allows the liquid aerosol-forming substrate to be conveyed fromthe liquid storage portion to the heater assembly by capillary action.The capillary material may substantially prevent and/or reduced leakageof the liquid aerosol-forming substrate from the liquid storage portion.

The liquid storage portion may be part of a cartridge, wherein thecartridge comprises the liquid storage portion and a mouthpiece. Thecartridge may be provided as a single-use cartridge which is disposedwhen the liquid aerosol-forming substrate in the liquid storage portionis depleted. In at least one example embodiment, the liquid storageportion may be a refillable liquid storage portion.

The mouthpiece portion may be connected to the main body of the deviceby a hinged connection. A hinged connection allows for a substantiallysimple insertion of the liquid storage portion into the device andremoval of the cartridge from the device. The mouthpiece portion may beretained in a closed position by a clasp mechanism. The clasp mechanismmay comprise a release button and may be configured to release themouthpiece portion when the release button is depressed. The mouthpieceportion may retained in a closed position by other mechanisms such as amagnetic closure or a by using a bi-stable hinge mechanism. Other meansof connection of the mouthpiece portion to the main body are possible,such as screw-fitting or snap-fitting.

The mouthpiece portion may include an air inlet and an air outlet. Themouthpiece portion may include a baffle configured to direct air drawnthrough the mouthpiece portion from the inlet to the outlet past thevaporiser in the cartridge. By keeping all the airflow within themouthpiece portion, the design of the main body may be simple, and onlythe mouthpiece portion of the device needs to be cleaned or replaced.Other airflow patterns are possible. Other orientations of the liquidstorage portion within the device are possible.

The heater element may be in the mouthpiece of the main body. By placingthe heater element in the mouthpiece of the main body, the heaterelement is directly adjacent to the liquid storage portion when theliquid storage portion is connected to the main body. The liquidaerosol-forming substrate from the liquid storage portion may be easilyconveyed from the liquid storage portion to the heater element.

At least one example embodiment relates to a process for manufacturing aheater assembly for an aerosol-generating system.

In at least one example embodiment, a process comprises providing aperforated glass substrate and providing a heater element in or on theglass substrate.

The perforated glass substrate may be manufactured and provided by aphase separation process, a sintering process, or a sol-gel process.

When the heater element is provided on the glass substrate, the heaterelement may be an electrically conductive thin film. Thus the glasssubstrate is coated with the heater element such that the heater elementis directly on the surface of the glass substrate. Consequently, theheater element may have essentially the same dimensions as the glasssubstrate. In other words, the heater element may comprise perforationswith essentially the same dimensions as described above with referenceto the glass substrate. Furthermore, the heater element may be fluidpermeable as described above with reference to the glass substrate.

When the heater element is provided in the glass substrate, a firstportion of the glass substrate is provided. Then, the heater element isprovided on the first portion of the glass substrate as a thin film.Subsequently, a second portion of the glass substrate is provided on thefirst portion and on the heater element. Thus, the first and secondportions of the glass substrate together encapsulate or encompass theheater element. Only contact portions of the heater element are notencapsulated by the glass substrate. The heater element may besandwiched between the first and second portion of the glass substrate.In the perforations of the glass substrate, the heater element may beexposed such that liquid aerosol-forming substrate may be vaporised inthe perforations. The heater element may be sandwiched between the firstand second portion of the glass substrate such that the heater elementonly comes into direct contact with the liquid aerosol-forming substratewithin the perforations. Thus, the heater element may be directlyexposed to the liquid aerosol-forming substrate within the perforations,while the rest of the heater element is isolated from the liquidaerosol-forming substrate by the first and second portion of the glasssubstrate.

FIGS. 1a, 1b, and 1b are illustrations of a heater assembly according toat least one example embodiment. The heater assembly comprises aperforated glass substrate 10 and a heater element 12, 14, 16.

The glass substrate 10 is generally a flat rectangular element having asize of about 5×5 square millimetres and a thickness of about 1millimeter. The small through holes or perforations 18 are provided in aregular pattern across the surface area of the glass substrate 10. Theperforations 18 have a width of about 50 microns and are separated fromeach other by a distance of about 50 microns.

The heating element 12, 14, 16 is between the perforations 18. In FIG.1a the heating element 12, 14, 16 is provided as parallel strips 16 of aconductive metallic thin film that are provided between alternating rowsof perforations 18.

In FIG. 1b the heating element 12, 14, 16 is in the form of parallelstrips and transversal strips 14 of a conductive metallic thin film thatform a heating mesh or heating grid wherein each cell of the meshcomprises one perforation 18.

In FIG. 1c the heating element 12, 14, 16 is in the form of a uniformthin film 12 provided on the surface area of the glass substrate 10surrounding the perforations 18.

FIG. 2 is an enlarged view of a single perforation 18. As shown in FIG.2, the metallic heating thin film 12 may also extend within theperiphery of the perforations 18.

In FIGS. 1a, 1b, 1c , and 2 the heater element 12, 14, 16 is on asurface of the glass substrate 10. In at least one example embodiment,the heater element 12, 14, 16 may also be within the glass substrate 10.In at least one example embodiment, the heater element 12, 14, 16 issandwiched between two or more layers of glass substrate 10, 10 a.

In at least one example embodiment, the heater element 12, 14, 16 doesnot extend completely to the peripheries of the perforations 18. Thus,the heater assembly may be configured such that contact between theheater element 12, 14, 16 and the liquid aerosol-forming substrate maybe avoided and/or at least substantially reduced.

The perforated heater assembly is brought into contact with a liquidstorage portion 20 as depicted in FIG. 3. The liquid storage portion 20may comprise a capillary material that contacts the heater assemblyensuring that the liquid aerosol-forming substrate is conveyed from theliquid storage portion 20 through the capillary element towards theheater assembly. Thus, the heater element 12, 14, 16 is at any timemoisturized with liquid aerosol-forming substrate. Upon application ofelectric power to the heater element 12, 14, 16, the heater assembly isheated and the liquid aerosol-forming substrate is evaporated eventuallyforming an aerosol.

FIGS. 4a, 4b, and 4c are illustrations of an aerosol-generating systemcomprising a main body 22. The main body 22 comprises electric circuitry24 and a battery 26. Furthermore, the main body 22 comprises the heaterassembly as described herein. The battery 26 is electrically connectedto the heater element 12, 14, 16 by contact portions of the heaterelement 12, 14, 16. The electric circuitry 24 controls the flow ofelectric current from the battery 26 to the heater element 12, 14, 16such that the heater element 12, 14, 16 is heated when theaerosol-generating system is activated. In order to activate theaerosol-generating system, the aerosol-generating system can comprise aflow sensor, which detects a draw on the aerosol-generating system.

In FIGS. 4a, 4b, and 4c , the heater element 12, 14, 16 is in amouthpiece 28. The mouthpiece 28 is part of the main body 22. Themouthpiece 28 is connected to the main body 22 by a hinged connectionand can move between an open position and a closed position as shown.The mouthpiece portion 28 is placed in the open position to allow forinsertion and removal of a liquid storage portion 20 and is placed inthe closed position when the system is to be used to generate aerosol.The mouthpiece 28 comprises a plurality of air inlets 30 and an outlet32. Air is drawn in through the air inlets 30. Internal baffles 34 areprovided to force the air flowing through the mouthpiece 28 past theliquid storage portion 20. The internal baffles 34, which are integrallymoulded with the external walls of the mouthpiece 28 ensure that, as airis drawn from the inlets 30 to the outlet 32, the air flows over theheater assembly where liquid aerosol-forming substrate is beingvaporised. As the air passes the heater assembly, vaporised substrate isentrained in the airflow and cools to form an aerosol before exiting theoutlet 32. In at least one example embodiment, the aerosol-formingsubstrate passes through the heater assembly by passing through theperforations 18 in the glass substrate 10 and the heater element 12, 14,16 as it is vaporised.

The liquid storage portion 20 contains the liquid aerosol-formingsubstrate. The liquid storage portion 20 is replaceable. The liquidstorage portion 20 is replaced once the liquid aerosol-forming substratein the liquid storage portion 20 is depleted.

The aerosol-generating system can be activated by a sensor in the mainbody 22 which senses a negative pressure due to a draw on the mouthpiece28. Then, the electric circuitry 24 controls a flow of electric currentfrom the battery 26 to the heater element 12, 14, 16 of the heaterassembly.

The liquid storage portion 20 comprises a sealing foil 36, which isremoved before inserting the liquid storage portion 20 into the mainbody 22. The sealing foil 36 reduces and/or substantially prevents theliquid aerosol-forming substrate from leaking out of the liquid storageportion 20 before the liquid storage portion 20 is fully inserted intothe main body 22 and the mouthpiece 28 is pivoted back in the closedposition.

The exemplary embodiments described above illustrate but are notlimiting. In view of the above discussed exemplary embodiments, otherembodiments consistent with the above exemplary embodiments will now beapparent to one of ordinary skill in the art.

We claim:
 1. A heater assembly for an aerosol-generating systemcomprising: a glass substrate including perforations, the perforationsarranged in rows; and a heater element in the glass substrate, on theglass substrate, or both in and on the glass substrate, the heaterelement including a plurality of parallel strips between alternatingrows of the perforations.
 2. The heater assembly according to claim 1,wherein the perforations have a width ranging from 1 micron to 500microns.
 3. The heater assembly according to claim 2, wherein the widthranges from 5 microns to 250 microns.
 4. The heater assembly accordingto claim 3, wherein the width ranges from 10 microns to 150 microns. 5.The heater assembly according to claim 1, wherein a distance betweenadjacent ones of the perforations in each of the rows ranges from 1micron to 1000 microns.
 6. The heater assembly according to claim 5,wherein the distance between adjacent ones of the perforations in eachof the rows ranges from 5 microns to 750 microns.
 7. The heater assemblyaccording to claim 6, wherein the distance between adjacent ones of theperforations in each of the rows ranges from 10 microns to 500 microns.8. The heater assembly according to claim 1, wherein a length of theheater assembly is 3 millimetres and a width of the heater assembly is 5millimetres.
 9. An aerosol-generating system comprising: a main bodyincluding, a battery in the main body, electric circuitry in the mainbody, and a mouthpiece in the main body; a liquid storage portionattachable to the main body; and a heater assembly in the main body, theheater assembly including, a glass substrate including perforations, theperforations arranged in rows, and a heater element in the glasssubstrate, on the glass substrate, or both in and on the glasssubstrate, the heater element including a plurality of parallel stripsbetween alternating rows of the perforations.
 10. The aerosol-generatingsystem according to claim 9, wherein the heater element is adjacent tothe liquid storage portion when the liquid storage portion is attachedto the main body.
 11. The aerosol-generating system according to claim9, wherein the heater element is in the mouthpiece.
 12. Theaerosol-generating system according to claim 9, wherein the perforationshave a width ranging from 1 micron to 500 microns.
 13. Theaerosol-generating system according to claim 12, wherein the widthranges from 5 microns to 250 microns.
 14. The aerosol-generating systemaccording to claim 13, wherein the width ranges from 10 microns to 150microns.
 15. The aerosol-generating system according to claim 9, whereina distance between adjacent ones of the perforations in each of the rowsranges from 1 micron to 1000 microns.
 16. The aerosol-generating systemaccording to claim 15, wherein the distance between adjacent ones of theperforations in each of the rows ranges from 5 microns to 750 microns.17. The aerosol-generating system according to claim 16, wherein thedistance between adjacent ones of the perforations in each of the rowsranges from 10 microns to 500 microns.
 18. aerosol-generating systemaccording to claim 9, wherein a length of the heater assembly is 3millimetres and a width of the heater assembly is 5 millimetres.